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NanoIC

A pilot line coordinated by imec aims to develop systems-on-chip based on beyond-2nm logic nodes. The pilot line offers low-threshold access to state-of-the-art equipment, as well as advanced research and development in new materials, processes, and modules.

FAMES

A pilot line coordinated by CEA-Leti aims to develop FD-SOI technology at 10nm and 7nm nodes, combined with non-volatile memory (NVM), RF components, and smart PMIC (power management for integrated circuits).

APECS

A pilot line coordinated by Fraunhofer aims to develop advanced packaging and heterogeneous integration of electronic components and systems. APECS offers innovation in heterogeneous integration based on chiplets, QMI, RF, opto, sensors, and passive components.

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